Leadless Ceramic Chip Carrier

A leadless chip carrier lcc has no leads but instead has rounded pins through the edges of the ceramic or molded plastic package.

Leadless ceramic chip carrier.

For electrical connection to the outside world the lcc instead uses flat metal contacts or metallized castellations known as pads around the four sides of the package bottom. Ceramic leadless chip carrier lcc jedec type leadless chip carriers continue their popularity for surface mount applications. Package outline material information. The leadless chip carrier s low profile multilayer construction offers short internal electrical traces from the die to the metalized castellations around all sides and bottom of the package.

Leadless chip carriers are ideal for surface mount applications. Plcc plastic leaded p plastic leaded chip carrier 50 mil pitch package drawing p. Gold or solder dip. Solder glass or epoxy seal.

Lcc trays legacy ltc trays for lcc packages legacy ltc view more. Leadless ceramic chip carrier legacy hittite package drawing e ey filter packages by entering lead count or product description into the search box below. The ceramic leadless chip carrier or clcc or lcc is a square or rectangular surface mount ceramic package that has no leads. Socket or surface mount package.

Prototypes and devices intended for extended temperature environments are typically packaged in ceramic while high volume products for consumer and commercial markets are typically packaged in plastic. 1st 2nd 3rd total seal ring die attach a x b c x d e x. Leadless ceramic chip carrier legacy ltc view more. Mm lead count pkg type or category cavity overall layer thickness ntk material code b black w white connection 0 non conect drawing no.

Clcc ceramic leadless chip carrier mm inch unit. Low profile multilayer ceramic package. Variety of body sizes. Footprint compatible with cqjb and plcc.